The responsibilities of a Backend / Far Backend Process Integration Engineer include but are not limited to:
- Driving experiments to develop the wafer fabrication interconnect process flow (lowest metal interconnect layer through C4) used in Intel's microprocessor and SOC designs.
- Developing robust die-package integration schemes through collaboration with Assembly Development and Quality & Reliability teams.
- Test chip design for metal interconnect and die-package process development.
- Analyzing yield, electrical parametric and fab monitor data.
- Working with process module equipment owners during development and process excursions; includes active participation and/or leading teams during issue troubleshooting, new equipment process evaluations, etc.
- Transfer the developed process to High Volume Manufacturing (HVM).
You must possess a Ph.D. in Electrical or Chemical Engineering, Materials Science, Chemistry or Physics.
Minimum Requirements:
Demonstrate experience in research or relevant job experience in areas pertaining to wafer fabrication or related technical fields.
Demonstrate experiences working with other groups and leading small teams through technical issues are a plus.
: Engineering
: USA-Oregon, Hillsboro
: Full Time
: Recent College Graduate
: Regular
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
: For U.S.: We will accept applications/resumes until 45 days after posting date or earlier at Intel’s discretion.
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